Kai Semi Ltd.,

Specialists in Cost-Reduced Replacement Chips
Cost reduction through FPGA-to-ASIC replacement
Replace End-Of-Life ASICs through ASIC-to-ASIC conversion
Reduce chip cost by merging multiple FPGAs/ASICs into a single-die replacement or into a multi-die single package replacement
Drop-in replacement = fully compatible second source chips
Drop-in functional replacements = decreased package size
Reduce costs and boost performance by DSP-to-ASIC conversion.
Reduce production costs
Reduce your FPGA chip cost by up to 70% through KaiSemi's proven process
Kaisemi quickly provide a guaranteed ASIC drop-in replacement with 'Zero-NRE' investment

www.forcetechnologies.co.uk

Solutions to EOL Products(End Of Life)
Providing aftermarket manufacture, Testing & Screening of semiconductor devices as FFF replacements to devices made obsolete by the original OEM.
Stock of over 42,000 different die and wafers,
DESC or vendor qualified sub-assembly sites offer quality levels equivalent to the original manufactures. Both in assembly and/or test facilities.
Packing from Commercial plastic to ceramic Mil-Std-883